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Mīkini ʻoki ʻoki Laser UV
Mīkini ʻoki ʻoki Laser UV

Mīkini ʻoki ʻoki Laser UV

Hoʻohana kēia kŘkohu i ka ikehu kiʻekiʻe, pōkole -pulse ultraviolet laser no ka ʻoki ʻana i ka FPC (Flexible Printed Circuits) a me ka PCB (Printed Circuit Boards), e hōʻike ana i ka laula ʻoki ʻoki ma lalo o 30 microns. Hāʻawi ia i nā ʻaoʻao ʻaoʻao maʻemaʻe i ʻoki ʻole ʻia i ka carbonization, me ke koʻikoʻi wela haʻahaʻa haʻahaʻa loa a me kahi wahi wela loa (HAZ).
Hoʻonohonoho pono ʻia no ka FPC, ka papa kaapuni, a me CCM (Camera Compact Module) ʻoihana, ua hoʻohui kēia ʻōnaehana ʻoki laser i nā mana he nui: ʻoki, wili, slotting, a me ka puka makani. Hoʻoponopono ʻo ia i nā ʻano mea like ʻole, me nā papa maʻalahi, nā papa ʻoʻoleʻa, nā -papa ʻoʻoleʻa, nā uhi uhi, a me nā pani-nui. Me kona wikiwiki ʻoki kiʻekiʻe, hoʻonui nui ka mīkini i ka hana hana. Ma ke ʻano he ʻoki kiʻekiʻe -ʻokiʻoki kiʻekiʻe, kiʻekiʻe{6}} hoʻonā ʻoki hiki ke hana hou ʻia, hāʻawi ʻo ia i ka maikaʻi o ke kumu kūʻai ʻokoʻa a me nā koina hana haʻahaʻa—e hoʻonui nui ana i ka hoʻokūkū ʻoihana ʻoihana.
E hoʻouna i ka noi

ʻO Shenzhen Chinasky Laser Technology Co., Ltd. kekahi o nā mea hana loea a me nā mea hoʻolako o ka mīkini ʻoki laser uv ma Kina. E ʻoluʻolu e ʻoluʻolu e kūʻai i ka mīkini ʻoki laser kiʻekiʻe me 2 mau makahiki palapala hōʻoia mai kā mākou hale hana. ʻAe mākou i nā kauoha i hoʻopilikino ʻia.

 

Hiʻona a me ka Pono

 

 Pākuʻi Mea Nui

Hoʻoponopono maikaʻi i nā mea paʻakikī me nā lasers ʻē aʻe, e like me nā plastics, ceramics, aniani, a me nā metala hoʻohālikelike e like me ke keleawe a me ka alumini.

 

 Nā Pūnaehana Holomua

Hāʻawi nā ʻenekini laina kiʻekiʻe a me nā mīkini galvanometer i ka māmā like ʻole a me ka pololei no nā ala ʻoki paʻakikī.

 

Hoʻolikelike ʻike i hoʻohui ʻia

Hiki i nā pahupaʻikiʻi hoʻonā kiʻekiʻe ke huli a hoʻopololei i nā ʻokiʻoki i nā hōʻailona hilinaʻi a i ʻole nā ​​hiʻohiʻona, e hōʻoia ana i ka pololei koʻikoʻi no nā PCB a me nā ʻāpana semiconductor.

 

ʻO nā wahi hoʻoponopono maikaʻi ʻia

Loaʻa i ka 460 mm x 460 mm kiʻekiʻe o ka hana laser no nā panela nui a i ʻole nā ​​ʻāpana he nui, me kahi kikoʻī 50 mm x 50 mm liʻiliʻi -wahi hana hiʻona. Hāʻawi kēia ʻano ʻelua -ʻano hiki ke hoʻololi like ʻole, mai ka hana ʻana i nā mea ʻano nui a hiki i ka hana ʻana i nā ʻāpana liʻiliʻi liʻiliʻi me ka pololei kiʻekiʻe.

 

ʻIkepili Kaʻina Hana Naʻauao

Hiki i nā mea kūʻai ke kūkulu a mālama i nā hale waihona puke ʻokiʻoki kūikawā no kēlā me kēia huahana. Hoʻopau kēia i nā hewa hana lima a hōʻoia i ka hala ʻole a me ka hopena hou ʻole me ka ʻike o ka mea hoʻohana.

 

Kiʻekiʻe -Kūkini Hoʻoholo pololei (XY-Axis)

Hoʻolako ʻia me ka -pae neʻe hana kiʻekiʻe e hāʻawi ana i ka māmā wikiwiki o 800 mm/s a me ka wikiwiki 1G kiʻekiʻe. Mālama kēia i ka hoʻonohonoho wikiwiki ʻana a e hōʻemi nui i ka manawa ʻole -ʻoki ʻole, e hoʻonui nui i ka hana holoʻokoʻa a me ka pono no ka hana ʻana o nā pūʻulu liʻiliʻi a nui.

 

Hoʻohana lako polokalamu hoʻomāmā

Aia i loko o ka polokalamu lako polokalamu nā hana intuitive e like me "Selective Cutting," "Tool-Based Cutting," a me "Material-Specific Parameter Presets." Hoʻomaʻamaʻa kēia i ka hoʻonohonoho hana paʻakikī i nā kaomi liʻiliʻi, e hōʻemi ana i ka manawa hoʻomaʻamaʻa mea hoʻohana a pale i nā hewa.

 

Moʻolelo & Hoʻomanaʻo ʻana

Hoʻopaʻa maʻalahi ka ʻōnaehana i ka ʻikepili ʻoki piha no kēlā me kēia huahana. No ka hoʻololi ʻana i nā hana, koho wale nā ​​mea hana i ka inoa huahana mai kahi papa inoa e hoʻomanaʻo koke i nā ʻāpana āpau, hiki ke hoʻololi wikiwiki a hoʻopau i nā hewa hoʻonohonoho no nā huahana i hōʻoia ʻia.

 

Hāʻawi ʻia ka hoʻokele hoʻokele hoʻokele kiʻekiʻe a me ke ala hōʻoia

Nā luna hoʻomalu me nā mea hana nānā ikaika. Hoʻopaʻa maʻalahi ka ʻōnaehana i nā hana a pau o ka mea hoʻohana, me ka manawa komo/puka, nā hoʻololi āpau i hana ʻia, a me ka mōʻaukala piha o nā faila ʻoki i hoʻohana ʻia. Mālama kēia i ka traceability piha a me ke kuleana a kōkua i nā diagnostics control quality.

 

Palapala noi

 

  • Semiconductor & IC Packaging:Wafer dicing (singulation), ʻoki silika, ʻoki ʻoki ʻana i ka substrate seramika, a me ka hana ʻana i nā papa alakaʻi.
  • Mea Uila Hikia (FPC):ʻOki pololei a ʻeli ʻana i nā Kaapuni Paʻi Paʻi ʻia (FPC), uhi uhi, a me ka polyimide lahilahi (PI) a me nā papa PET.
  • ʻEnekinia pololei:Ke ʻoki ʻana i nā metala lahilahi (ke keleawe, nā alumini alumini), ka hana ʻana i nā ʻōnaehana micro{0}}electromechanical (MEMS), a me ka hana ʻana i nā metala maikaʻi a me nā kānana.
  • Mea Hoʻohana Electronics:ʻOki ʻana i ke aniani a me ka sapphire no nā modula kamera, nā mea ʻike paʻi, a me nā mea hōʻike; hōʻailona a ʻokiʻoki i nā ʻāpana kelepona.

 

FAQ

Nīnau: Pehea ka ʻoki ʻana o ka laser UV mai kahi CO2 a i ʻole ka fiber laser?

A: Hoʻohana mua nā lasers CO2 a me nā fiber i ka wela e hoʻoheheʻe ai ʻole e hoʻoheheʻe i nā mea akā hoʻohana ka laser UV i ke kaʻina hana "anu" i kapa ʻia ʻo -ablation. ʻO kona lōʻihi hawewe pōkole a me ka ikehu photon kiʻekiʻe e wāwahi pololei i nā paʻa molekala o ka mea, e hoʻoneʻe pono i nā mea me ka liʻiliʻi o ka hoʻoili wela i ka wahi a puni.

Nīnau: He aha nā mea e hiki ke ʻoki maikaʻi i ka laser UV?

A: ʻOi aku ka maikaʻi o nā lasers UV i ka ʻoki ʻana i kahi ākea o nā mea paʻakikī a paʻakikī, me:
● Plastics & Polymers: Polyimide (PI), PET, PEEK, PTFE, a me nā mea ʻenehana ʻenehana ʻē aʻe.
● Nā Metala ʻAiʻi & Hoʻohālikelike: ʻO ke keleawe, ka aluminika, ke gula, a me ke kala kala me ka ʻike ʻole ʻana i ke kukui.
● Hemi: Alumina, zirconia, a me nā mea pāpaʻi ʻē aʻe me ka ʻole o ka māwae micro{0}}.
● Glass & Sapphire: No nā ʻoki maʻemaʻe, hoʻomalu ʻia a me ka ʻeli ʻana me ka haki ʻole.
● Mea Semiconductor: Silicon, gallium arsenide, a me nā mea hoʻohuihui semiconductor.

Q: Pehea ka pololei o ka mīkini ʻoki laser UV?

A: He kiʻekiʻe loa ka pololei o ka mīkini ʻoki laser UV. Hiki ke emi ma lalo o 20 um ka wahi kukui focal liʻiliʻi, a liʻiliʻi loa ka ʻoki ʻoki. Hiki i nā mīkini ke hoʻokō i ka pololei o ka hoʻonohonoho ʻana o ± 3 um a me ka pololei hou o ± 1 um, me ka pololei o ka hoʻoponopono ʻana i ka ʻōnaehana o ± 20 um.

Nīnau: He aha nā pōmaikaʻi mua o ke kaʻina hana "ʻoki anuanu"?

A: ʻO nā pōmaikaʻi nui

  1. ʻAʻohe pōʻino wela: hoʻopau i ke ahi, hoʻoheheʻe, a me ka wela-deformation.
  2. ʻOi aku ka maikaʻi ʻoi aku ka maikaʻi: Hoʻopuka i nā paia maʻemaʻe a pololei me ka ʻole o ka burrs a i ʻole ka pala.
  3. HAZ liʻiliʻi: Mālama i ka pono o ka mea e puni ana i ka ʻoki.
  4. Hiki ke 'oki i ka wela-mea maalea: hiki ke hana i na mea i lukuia e na laser wela.

Q: He aha ke ʻano mānoanoa maʻamau no nā mea i ʻoki ʻia me ka laser UV?

A: Hoʻomaʻamaʻa ʻia nā laser UV no ka hana ultra{0}}pololei ma nā mea lahilahi a maʻalahi. ʻO ka laulā kūpono mai ka 1 micron a hiki i ka 1-2 mm, e pili ana i nā waiwai o ka mea. ʻAʻole lākou i hoʻolālā ʻia no ka ʻoki ʻana i nā papa metala mānoanoa a i ʻole nā ​​poloka.

Nīnau: Ua palekana anei ka ʻōnaehana laser UV e hana?

A: ʻOiaʻiʻo. Hoʻopili piha ʻia ka laser i loko o kahi keʻena i hoʻopaʻa ʻia me ka palekana, me ka hōʻoia ʻana ʻaʻole hiki ke pakele i ka radiation UV i ka wā o ka hana. Hiki i nā mea hana ke hoʻouka a hoʻokuʻu i nā ʻāpana me ka ʻole o ka pilikia o ka ʻike.

Nā huahana pale: uv laser cutting machine, China uv laser cutting machine, mea hoʻolako, hale hana

Nā ʻāpana ʻenehana

 

Hoʻohālike

HT -UVC15

Mana laser

15 W

ʻAno laser

UV Laser

Ka lōʻihi hawewe laser

355 nm

Wahi Kaʻina Hoʻokahi

50×50 mm

Huina Hana Hana

460 mm × 460 mm (Hiki ke hoʻololi ʻia)

CCD Auto -Ka pololei o ka Alignment

±3 μm

'Aunoa -Hana Hana

ʻAe

XY-Axis Repositioning Pono

±1 μm

XY-Pono Hoʻonohonoho ʻAxis

±3 μm

Kākoʻo ʻia nā waihona waihona

DXF, DWG, GBR, CAD a me nā mea hou aku